TY  - JOUR 
T1  - Correlation Between Electromechanical Impedance and Thermal Analysis for Adhesive Cure Time Evaluation in SHM GW Applications
JO  - Materials Research
A1  - Jacques, R. C.
A1  - Corrêa, L. A.
A1  - Ferreira, C. A.
A1  - Clarke, T. G. R.
SN  - 1516-1439
UL  - 10.1590/1980-5373-MR-2024-0313
VL  - 27 
Y1  - 2024
PB  - Brasil 
ER  -